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In all plating applications, the working principle of metal plating is basically the same. The required plating metal is dissolved in the electrolyte, the plated metal matrix is used as the negative electrode, and the anode is used as the positive electrode, which forms a complete current transmission cycle. The chemical reaction that occurs simultaneously with plating in the plating bath is the oxygen evolution on the anode surface. For example: copper nickel plating; decorative plating (trivalent chromium plating, jewelry, glasses, home decorative hardware plating); rack plating and barrel plating processes in different applications; electro-forming (dental products, contact bushings and pins, etc.); hard chromium plating; special plating; electro-coating; tin copper plating, etc. The principle of metal plating is almost identical for all applications. The metal to be plated is dissolved in the electrolyte and the object to be plated is cathodically polarised. With the anodically polarised anodes, the electrical loop is closed. The counter reaction in the plating bath is oxygen evolution at the anode surface. For example:Nickel and copper plating；decoration plating((trivalent chromium plating,jewelry, glasses,household goods, fittings,)；Rack plating, roll plating, barrel plating and strip plating of variety of products for technical applications；Electro-forming of dentistry, contact bushes and pins etc；hard chromium plating；special plating；electrophoretic painting;copper-tin plating,etc.
